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MBCG46533-144PFV-G Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
MBCG46533-144PFV-GFUJ1769Yes

Manufacturer:** FUJ **Part Number:** MBCG46533-144PFV-G ### **Specifications:** - **Package Type:** 144-Pin Fine-Pitch Ball Grid Array (FBGA) - **Operating Temperature Range:** -40°C to +85°C (Industrial Grade) - **Supply Voltage:** Typicall

Manufacturer: FUJ

Part Number: MBCG46533-144PFV-G

Specifications:

  • Package Type: 144-Pin Fine-Pitch Ball Grid Array (FBGA)
  • Operating Temperature Range: -40°C to +85°C (Industrial Grade)
  • Supply Voltage: Typically 1.2V (core), 2.5V/3.3V (I/O)
  • Memory Type: Embedded Flash or SRAM (specific type depends on variant)
  • Speed Grade: Varies by model (check datasheet for exact speed ratings)
  • RoHS Compliance: Yes

Descriptions:

The MBCG46533-144PFV-G is a high-performance, low-power integrated circuit designed for embedded applications. It features a compact 144-pin FBGA package, making it suitable for space-constrained designs. This component is commonly used in industrial, automotive, and consumer electronics for processing, memory storage, or interface control.

Features:

  • High-Speed Operation: Optimized for fast data processing.
  • Low Power Consumption: Designed for energy-efficient applications.
  • Robust I/O Support: Multiple voltage levels for flexible interfacing.
  • Reliable Packaging: FBGA ensures stable performance in harsh environments.
  • Industrial-Grade Durability: Operates reliably across a wide temperature range.

For detailed electrical characteristics and application-specific details, refer to the official FUJ datasheet.

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