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2SC4367 Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
2SC4367HIT950Yes

2SC4367** is a high-frequency transistor manufactured by **HIT (Hitachi)**.

The 2SC4367 is a high-frequency transistor manufactured by HIT (Hitachi). Below are its key specifications, descriptions, and features:

Specifications:

  • Type: NPN Silicon Epitaxial Planar Transistor
  • Application: High-frequency amplification (VHF/UHF bands)
  • Collector-Base Voltage (VCBO): 30V
  • Collector-Emitter Voltage (VCEO): 15V
  • Emitter-Base Voltage (VEBO): 3V
  • Collector Current (IC): 50mA
  • Total Power Dissipation (PT): 300mW
  • Transition Frequency (fT): 7GHz (typical)
  • Noise Figure (NF): 1.5dB (typical at 1GHz)
  • Gain (hFE): 20-200 (at VCE=6V, IC=5mA)
  • Package: TO-92 (small plastic package)

Descriptions:

  • Designed for low-noise, high-frequency amplification in RF circuits.
  • Suitable for VHF/UHF applications, including wireless communication devices.
  • Features low collector saturation voltage and high-speed switching.

Features:

  • High fT (7GHz) for excellent high-frequency performance.
  • Low noise figure (1.5dB) for sensitive signal amplification.
  • Compact TO-92 package for easy PCB mounting.
  • Wide hFE range (20-200) for flexible circuit design.

This transistor is commonly used in RF amplifiers, oscillators, and communication circuits. For detailed performance curves and absolute maximum ratings, refer to the official datasheet from HIT (Hitachi).

# 2SC4367 Transistor: Practical Applications, Design Pitfalls, and Implementation Considerations

## 1. Practical Application Scenarios

The 2SC4367 is a high-frequency NPN bipolar junction transistor (BJT) manufactured by HIT, designed for RF amplification and switching applications. Its key characteristics—high transition frequency (fT), low noise, and moderate power handling—make it suitable for several scenarios:

RF Amplification

The 2SC4367 excels in small-signal RF amplification, particularly in VHF/UHF bands (30 MHz to 3 GHz). Common uses include:

  • Low-noise amplifiers (LNAs) in communication receivers
  • Intermediate frequency (IF) stages in radio transceivers
  • Oscillator circuits requiring stable high-frequency operation

Switching Circuits

While primarily an RF device, the 2SC4367 can function in fast-switching applications such as:

  • Pulse modulation circuits
  • High-speed digital switching where low saturation voltage is beneficial

Cascode and Darlington Configurations

For improved gain and bandwidth, the 2SC4367 is often used in cascode amplifiers or paired with a PNP transistor in Darlington arrangements for higher current gain.

## 2. Common Design-Phase Pitfalls and Avoidance Strategies

Thermal Runaway in High-Gain Circuits

The 2SC4367’s high current gain (hFE) can lead to thermal instability if not properly biased.

Mitigation:

  • Use emitter degeneration resistors to stabilize bias points.
  • Implement temperature compensation (e.g., diode-based biasing).

Parasitic Oscillations in RF Circuits

Poor PCB layout or improper impedance matching can induce unwanted oscillations.

Mitigation:

  • Use ground planes and minimize trace lengths.
  • Apply proper RF shielding and decoupling capacitors near the transistor.

Overvoltage and ESD Sensitivity

The 2SC4367’s thin base-emitter junction is susceptible to electrostatic discharge (ESD).

Mitigation:

  • Follow ESD handling protocols during assembly.
  • Incorporate transient voltage suppression (TVS) diodes in high-risk circuits.

## 3. Key Technical Considerations for Implementation

Biasing Requirements

  • Voltage Range: Operates optimally at VCE = 12V (max 20V).
  • Current Handling: IC(max) = 50mA; ensure heat dissipation for sustained operation.

Impedance Matching

For RF applications, match input/output impedances (typically 50Ω) using microstrip lines or LC networks to minimize reflections.

Package and Heat Dissipation

The 2SC4367 is typically housed in a TO-92 or SOT-23 package. For prolonged high-power operation, consider:

  • Adding a small heatsink.
  • Using thermal vias in PCB designs.

By addressing these factors, designers can maximize the 2SC4367’s performance while avoiding common failure modes.

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