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IRFR6215TR Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
IRFR6215TRIR146Yes

IRFR6215TR is a Power MOSFET manufactured by Infineon Technologies.

The IRFR6215TR is a Power MOSFET manufactured by Infineon Technologies. Below are the factual details about its specifications, descriptions, and features:

Manufacturer:

Infineon Technologies

Specifications:

  • Drain-Source Voltage (VDS): 150V
  • Continuous Drain Current (ID): 5.3A
  • Pulsed Drain Current (IDM): 21A
  • Power Dissipation (PD): 45W
  • Gate-Source Voltage (VGS): ±20V
  • On-Resistance (RDS(on)): 0.27Ω (max) at VGS = 10V
  • Threshold Voltage (VGS(th)): 2V to 4V
  • Input Capacitance (Ciss): 370pF
  • Output Capacitance (Coss): 60pF
  • Reverse Transfer Capacitance (Crss): 20pF
  • Turn-On Delay Time (td(on)): 10ns
  • Turn-Off Delay Time (td(off)): 35ns
  • Operating Junction Temperature (TJ): -55°C to +150°C

Description:

The IRFR6215TR is an N-channel Power MOSFET designed for high-speed switching applications. It features low on-resistance, fast switching speeds, and high efficiency, making it suitable for power management, DC-DC converters, motor control, and other switching applications.

Features:

  • Low On-Resistance: Minimizes conduction losses.
  • Fast Switching: Optimized for high-frequency applications.
  • Avalanche Energy Rated: Enhances reliability in rugged environments.
  • Lead-Free & RoHS Compliant: Meets environmental standards.
  • TO-252 (DPAK) Package: Compact surface-mount design for efficient PCB space utilization.

This information is based on Infineon's datasheet for the IRFR6215TR.

# Application Scenarios and Design Phase Pitfall Avoidance for the IRFR6215TR Power MOSFET

The IRFR6215TR is a P-channel power MOSFET designed for high-efficiency switching applications. With a low on-resistance (RDS(on)) and robust thermal performance, it is widely used in power management circuits, DC-DC converters, and motor control systems. Understanding its key application scenarios and common design pitfalls ensures optimal performance and reliability in electronic designs.

## Key Application Scenarios

1. DC-DC Converters

The IRFR6215TR is well-suited for step-down (buck) and step-up (boost) converters due to its low conduction losses and fast switching characteristics. Its P-channel configuration simplifies gate drive requirements in high-side switching applications, making it a preferred choice for voltage regulation in battery-powered devices and power supplies.

2. Load Switching and Power Distribution

In systems requiring efficient power distribution, such as automotive electronics or industrial control modules, the IRFR6215TR acts as a reliable load switch. Its low RDS(on)

3. Motor Drive Circuits

For low-power motor control in robotics or consumer electronics, this MOSFET provides smooth switching with minimal heat generation. Designers often use it in H-bridge configurations alongside N-channel MOSFETs to achieve bidirectional motor control.

4. Battery Management Systems (BMS)

The IRFR6215TR is effective in protecting battery packs from over-discharge or reverse polarity conditions. Its ability to handle moderate current levels makes it suitable for battery disconnect switches in portable electronics and energy storage systems.

## Design Phase Pitfall Avoidance

1. Gate Drive Considerations

Since the IRFR6215TR is a P-channel MOSFET, proper gate drive voltage is critical. A gate-source voltage (VGS) significantly lower than the rated threshold ensures full enhancement, reducing conduction losses. Underdriving the gate can lead to excessive RDS(on)

2. Thermal Management

Despite its low RDS(on)

3. Voltage and Current Ratings

Exceeding the maximum drain-source voltage (VDSS) or continuous drain current (ID) ratings can lead to catastrophic failure. Designers must account for voltage spikes in inductive loads (e.g., motors) and incorporate snubber circuits or freewheeling diodes where necessary.

4. PCB Layout Optimization

Poor PCB layout can introduce parasitic inductance, leading to voltage spikes and switching losses. Minimizing loop area in high-current paths and placing decoupling capacitors close to the MOSFET terminals enhances performance and reduces EMI.

5. ESD and Transient Protection

The IRFR6215TR’s gate oxide is sensitive to electrostatic discharge (ESD). Proper handling during assembly and the inclusion of transient voltage suppressors (TVS) or gate resistors can prevent damage from voltage surges.

By carefully considering these factors, engineers can leverage the IRFR6215TR’s strengths while mitigating risks in power electronics designs. Thorough simulation, prototyping, and validation further ensure reliable operation across diverse applications.

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