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IS43TR16512BL-125KBLI Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
IS43TR16512BL-125KBLIISSI 565Yes

IS43TR16512BL-125KBLI** is a DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) component manufactured by **ISSI (Integrated Silicon Solution Inc.

The IS43TR16512BL-125KBLI is a DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) component manufactured by ISSI (Integrated Silicon Solution Inc.). Below are its key specifications, descriptions, and features:

Specifications:

  • Memory Type: DDR3 SDRAM
  • Density: 512M x 16 (8Gb)
  • Organization: 16M x 16 x 8 banks
  • Speed Grade: -125K (800MHz, CL=11, tRCD=11, tRP=11)
  • Voltage: 1.5V ±0.075V (VDD & VDDQ)
  • Data Rate: 1600 Mbps/pin (DDR3-1600)
  • Interface: SSTL_15 (1.5V I/O)
  • Package: 96-ball FBGA (8mm x 14mm x 1.2mm)
  • Operating Temperature: Commercial (0°C to +85°C)
  • Refresh Rate: 8192 cycles/64ms
  • Burst Length: 8 (BC4 & BL8 supported)
  • CAS Latency (CL): 5, 6, 7, 8, 9, 10, 11 (programmable)
  • Precharge: Auto & Self-Refresh

Descriptions:

  • The IS43TR16512BL-125KBLI is a low-power, high-performance DDR3 SDRAM designed for applications requiring high bandwidth and low latency.
  • It supports fly-by topology for improved signal integrity in high-speed systems.
  • Features on-die termination (ODT) and ZQ calibration for better signal integrity.
  • Compliant with JEDEC DDR3 standards (JESD79-3F).

Features:

  • High-Speed Operation: Up to 1600 Mbps data transfer rate.
  • Low Power Consumption: 1.5V operation with power-saving modes (Self-Refresh, Partial Array Self-Refresh).
  • Programmable CAS Latency (CL): Supports 5, 6, 7, 8, 9, 10, 11.
  • Write Leveling & Read Leveling: Ensures timing alignment in high-speed systems.
  • On-Die Termination (ODT): Reduces signal reflections for better signal integrity.
  • ZQ Calibration: Adjusts output drive strength dynamically.
  • FBGA Package: 96-ball (8mm x 14mm x 1.2mm) for compact PCB designs.

This DDR3 SDRAM is commonly used in networking, industrial, automotive, and consumer electronics applications requiring high-speed memory access.

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