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PIC16F887T-I/PT Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
PIC16F887T-I/PTMICROCHIP1000Yes

PIC16F887T-I/PT** is a microcontroller from **Microchip Technology**.

The PIC16F887T-I/PT is a microcontroller from Microchip Technology. Below are its specifications, descriptions, and features:

Specifications

  • Manufacturer: MicroCHIP
  • Core: 8-bit PIC
  • Architecture: Modified Harvard
  • CPU Speed (MIPS): 5 MIPS at 20 MHz
  • Program Memory Type: Flash
  • Program Memory Size (KB): 14 KB
  • RAM Bytes: 368 Bytes
  • EEPROM/Data Flash (Bytes): 256 Bytes
  • Digital Communication Peripherals:
  • 1 x UART
  • 1 x SPI
  • 1 x I2C
  • Timers:
  • 1 x 8-bit
  • 2 x 16-bit
  • ADC Channels: 14 (10-bit resolution)
  • Comparators: 2
  • PWM Channels: 2
  • Operating Voltage Range: 2.0V to 5.5V
  • Operating Temperature Range: -40°C to +85°C
  • Package: 44-pin TQFP (PT)

Descriptions

The PIC16F887T-I/PT is a mid-range 8-bit microcontroller with enhanced features, including a wide operating voltage range, robust peripheral integration, and low-power consumption. It is suitable for embedded control applications such as industrial, automotive, and consumer electronics.

Features

  • Enhanced Mid-Range Core:
  • 35 instructions
  • 8-level deep hardware stack
  • Flexible Oscillator Options:
  • Internal and external clock sources
  • PLL for clock multiplication
  • Low-Power Features:
  • Sleep mode
  • Multiple wake-up options
  • Analog Features:
  • 10-bit ADC with up to 14 channels
  • Two analog comparators
  • Communication Interfaces:
  • USART (UART)
  • SPI (Master/Slave)
  • I2C (Master/Slave)
  • Enhanced Capture/Compare/PWM (ECCP):
  • Up to 2 PWM outputs
  • Robust I/O:
  • Up to 35 I/O pins
  • Individually programmable pull-ups
  • Interrupt-on-change capability
  • Package:
  • 44-pin TQFP (Thin Quad Flat Pack)

This microcontroller is designed for applications requiring moderate processing power, analog sensing, and communication capabilities in a compact form factor.

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