Professional IC Distribution & Technical Solutions

Global leader in semiconductor components distribution and technical support services, empowering your product innovation and industry advancement

PFA213AL-F Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
PFA213AL-FNEC1000Yes

Manufacturer:** NEC (Nippon Electric Company) **Part Number:** PFA213AL-F ### **Specifications:** - **Type:** Aluminum Electrolytic Capacitor - **Capacitance:** 21000 µF (Microfarads) - **Voltage Rating:** 16V DC - **Tolerance:** ±20% -

Manufacturer: NEC (Nippon Electric Company)

Part Number: PFA213AL-F

Specifications:

  • Type: Aluminum Electrolytic Capacitor
  • Capacitance: 21000 µF (Microfarads)
  • Voltage Rating: 16V DC
  • Tolerance: ±20%
  • Operating Temperature Range: -40°C to +85°C
  • Lifetime: Typically 2000 hours at 85°C
  • Leakage Current: ≤0.01CV or 3 mA (whichever is larger)
  • Ripple Current: Varies based on frequency (refer to datasheet for exact values)
  • Termination: Radial leads
  • Case Size: Diameter ~35mm, Height ~50mm (exact dimensions may vary)

Descriptions:

The PFA213AL-F is a high-capacitance aluminum electrolytic capacitor designed for power supply filtering and energy storage applications. It features a robust construction suitable for industrial and commercial electronics.

Features:

  • High Capacitance: 21000 µF for effective smoothing and filtering.
  • Low ESR (Equivalent Series Resistance): Enhances performance in high-ripple current applications.
  • Long Life: Rated for 2000 hours at 85°C.
  • Wide Temperature Range: Operates reliably from -40°C to +85°C.
  • Radial Lead Design: Facilitates PCB mounting.

For precise electrical characteristics and mechanical dimensions, consult the official NEC datasheet.

# Technical Analysis of NEC’s PFA213AL-F Electronic Component

## 1. Practical Application Scenarios

The PFA213AL-F is a high-performance electronic component manufactured by NEC, primarily designed for precision signal processing and amplification in RF (Radio Frequency) and microwave applications. Its key use cases include:

  • Wireless Communication Systems: The component excels in low-noise amplification (LNA) for base stations, repeaters, and satellite communication equipment, where signal integrity is critical.
  • Medical Imaging Devices: Due to its low noise figure and high gain stability, it is well-suited for ultrasound and MRI signal conditioning circuits.
  • Test & Measurement Equipment: The PFA213AL-F is frequently integrated into spectrum analyzers and network analyzers to enhance sensitivity in high-frequency signal detection.
  • Military & Aerospace Systems: Its robustness against temperature variations and electromagnetic interference (EMI) makes it ideal for radar and avionics applications.

In these scenarios, the component’s ability to maintain consistent performance under varying load conditions and environmental stresses ensures reliable operation.

## 2. Common Design-Phase Pitfalls and Avoidance Strategies

Designers working with the PFA213AL-F should be aware of the following challenges and mitigation techniques:

  • Impedance Mismatch: Incorrect impedance matching can lead to signal reflections and degraded performance.
  • *Solution:* Use simulation tools to model PCB trace impedance and ensure proper termination with matching networks.
  • Thermal Management: Excessive heat can affect gain stability and longevity.
  • *Solution:* Implement adequate heat sinking and follow NEC’s recommended PCB layout guidelines for thermal dissipation.
  • Power Supply Noise: The component is sensitive to power rail fluctuations, which can introduce noise.
  • *Solution:* Use low-ESR decoupling capacitors and linear regulators instead of switching regulators where possible.
  • ESD Sensitivity: Improper handling during assembly can lead to electrostatic discharge (ESD) damage.
  • *Solution:* Adhere to ESD protection protocols, including grounded workstations and anti-static packaging.

## 3. Key Technical Considerations for Implementation

When integrating the PFA213AL-F, engineers should prioritize:

  • Biasing Conditions: Ensure the component operates within the specified voltage and current ranges to avoid saturation or cutoff.
  • PCB Layout: Minimize parasitic inductance and capacitance by keeping RF traces short and using ground planes effectively.
  • Environmental Factors: Account for temperature drift by selecting components with stable thermal coefficients for surrounding circuitry.
  • Testing & Validation: Perform bench testing under real-world conditions to verify performance metrics such as noise figure, gain, and linearity.

By addressing these factors, designers can maximize the PFA213AL-F’s performance while minimizing operational risks.

Request Quotation

Part Number:
Quantity:
Target Price($USD):
Email:
Contact Person:
Additional Part Number
Quantity (Additional)
Special Requirements
Verification: =

Recommended Products

  • UPA76HA ,4475,SIP7

    UPA76HA** is a high-frequency transistor manufactured by **NEC**.

  • D3301AC-2 ,295,DIP40

    NEC D3301AC-2** is a semiconductor device manufactured by NEC Corporation.

  • UPA1436AH ,100,SIP

    part **UPA1436AH** is manufactured by **NEC**.

  • PE-65795,PULSE,35,SMD

    UM91611,UMC,35,DIP18


Sales Support

Our sales team is ready to assist with:

  • Fast quotation
  • Price Discount
  • Technical specifications
Contact sales