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UPD6117C Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
UPD6117CNEC225Yes

UPD6117C** is a microcontroller manufactured by **NEC** (now part of Renesas Electronics).

The UPD6117C is a microcontroller manufactured by NEC (now part of Renesas Electronics). Below are its key specifications, descriptions, and features:

Specifications:

  • Manufacturer: NEC (Now Renesas Electronics)
  • Architecture: 8-bit microcontroller
  • Core: 78K0 series (NEC 8-bit core)
  • Clock Speed: Up to 10 MHz
  • ROM (Program Memory): 16 KB (Mask ROM)
  • RAM (Data Memory): 512 bytes
  • I/O Ports: Multiple general-purpose I/O pins
  • Timers: Includes 8-bit and 16-bit timers
  • Serial Communication: UART (Serial Interface)
  • ADC (Analog-to-Digital Converter): 8-bit, 8-channel
  • Operating Voltage: 4.5V to 5.5V (typical 5V operation)
  • Package Type: DIP (Dual In-line Package), PLCC, or QFP (varies by model)
  • Temperature Range: -40°C to +85°C (industrial grade)

Descriptions:

  • The UPD6117C is an 8-bit microcontroller designed for embedded control applications.
  • It belongs to NEC’s 78K0 family, optimized for cost-sensitive and power-efficient designs.
  • Suitable for appliance control, industrial automation, and consumer electronics.

Features:

  • Low-power operation with multiple power-saving modes.
  • On-chip oscillators (RC or crystal-based).
  • Interrupt handling with multiple priority levels.
  • Watchdog timer (WDT) for system reliability.
  • Compact and efficient instruction set for fast execution.
  • Mask ROM version (factory-programmed, not user-rewritable).

This microcontroller is now considered obsolete (EOL) by Renesas, with newer alternatives available in the 78K0 series.

Would you like additional details on pinouts or replacement options?

# UPD6117C: Application Scenarios, Design Pitfalls, and Implementation Considerations

## 1. Practical Application Scenarios

The UPD6117C, manufactured by NEC, is a specialized integrated circuit (IC) primarily designed for signal processing and control applications. Its key features include high-speed operation, low power consumption, and versatile interfacing capabilities, making it suitable for several use cases:

  • Communication Systems: The UPD6117C is often employed in digital communication modules, such as modems and transceivers, where it processes baseband signals with minimal latency. Its ability to handle high-frequency signals ensures reliable data transmission in both wired and wireless systems.
  • Industrial Automation: In motor control and sensor interfacing applications, the IC’s precision timing and signal conditioning capabilities enhance system responsiveness. It is commonly integrated into programmable logic controllers (PLCs) for real-time signal processing.
  • Consumer Electronics: Devices like digital audio processors and display controllers leverage the UPD6117C’s efficient data handling to improve performance while maintaining low power consumption, critical for battery-operated gadgets.
  • Embedded Systems: The IC’s compact footprint and compatibility with microcontrollers make it ideal for embedded designs requiring auxiliary signal processing, such as filtering or analog-to-digital conversion.

## 2. Common Design-Phase Pitfalls and Avoidance Strategies

Pitfall 1: Improper Power Supply Decoupling

The UPD6117C’s high-speed operation makes it sensitive to power noise. Inadequate decoupling can lead to signal integrity issues.

Solution:

  • Use low-ESR capacitors (e.g., 100nF ceramic) near the power pins.
  • Implement a multi-stage decoupling network with bulk capacitors (10µF) for stable voltage regulation.

Pitfall 2: Signal Integrity Degradation

High-frequency signal paths are prone to reflections and crosstalk, especially in poorly routed PCB designs.

Solution:

  • Maintain controlled impedance traces for critical signals.
  • Use ground planes to minimize EMI and ensure proper return paths.

Pitfall 3: Thermal Management Oversights

Sustained high-speed operation can cause heat buildup, affecting reliability.

Solution:

  • Ensure adequate PCB copper pours for heat dissipation.
  • Consider a heatsink or airflow optimization in high-duty-cycle applications.

## 3. Key Technical Considerations for Implementation

  • Clock Synchronization: The UPD6117C relies on precise clock signals. Use a low-jitter oscillator and minimize trace length mismatches to prevent timing errors.
  • Interface Compatibility: Verify voltage level compatibility (e.g., 3.3V vs. 5V) with connected devices to avoid signal corruption.
  • Software Configuration: Ensure firmware correctly initializes control registers, as improper settings may lead to undefined behavior.

By addressing these factors, designers can maximize the UPD6117C’s performance while mitigating common risks in deployment.

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