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MM74HC75N Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
MM74HC75NNS223Yes

MM74HC75N is a quad bistable latch manufactured by National Semiconductor (NS).

The MM74HC75N is a quad bistable latch manufactured by National Semiconductor (NS).

Specifications:

  • Logic Family: HC (High-Speed CMOS)
  • Function: Quad Bistable Latch
  • Number of Circuits: 4
  • Number of Bits per Latch: 1
  • Supply Voltage Range: 2V to 6V
  • High-Level Input Voltage (Min): 2V
  • Low-Level Input Voltage (Max): 0.8V
  • Operating Temperature Range: -40°C to +85°C
  • Package / Case: 16-DIP (Dual In-Line Package)
  • Mounting Type: Through Hole
  • Propagation Delay Time: 15ns (typical at 5V)
  • Output Current: ±5.2mA
  • Power Dissipation: 500mW

Descriptions:

The MM74HC75N is a high-speed CMOS quad bistable latch with four independent D-type latches. Each latch has a data input (D), an enable input (E), and a complementary output (Q and Q̅). When the enable input is high, the output follows the data input. When the enable input is low, the output is held at the last data input state.

Features:

  • High-Speed Operation: Compatible with TTL levels
  • Low Power Consumption: CMOS technology
  • Wide Operating Voltage Range: 2V to 6V
  • Balanced Propagation Delays
  • High Noise Immunity
  • Direct Interface with TTL, NMOS, and CMOS

This information is strictly factual and based on manufacturer specifications.

# MM74HC75N: Application Scenarios, Design Pitfalls, and Implementation Considerations

## Practical Application Scenarios

The MM74HC75N is a quad bistable latch from the high-speed CMOS (HC) family, designed for temporary data storage in digital systems. Its primary applications include:

1. Data Buffering and Synchronization

The latch is commonly used to stabilize asynchronous data inputs before processing. For example, in microcontroller-based systems, the MM74HC75N can hold sensor data until the CPU is ready to read it, preventing metastability issues during clock domain crossings.

2. Input/Output Expansion

When interfacing with peripherals requiring multiple control signals, the latch serves as a cost-effective I/O expander. By latching address or control lines, it reduces the pin count burden on microcontrollers or FPGAs.

3. State Retention in Power-Sensitive Designs

The device’s low power consumption (typical ICC = 4 µA at 25°C) makes it suitable for battery-powered systems where state retention is critical during sleep modes.

4. Glitch Filtering

The latch can suppress transient signals in noisy environments, such as industrial control systems, by holding valid data only when the enable (E) input is asserted.

## Common Design Pitfalls and Avoidance Strategies

1. Unintended Latch Transparency

The MM74HC75N becomes transparent when the enable (E) pin is high, allowing data to pass through. If the enable signal has glitches, unintended data changes may occur.

*Mitigation:* Use a clean, debounced enable signal and ensure minimal overlap between data and enable transitions.

2. Inadequate Decoupling

High-speed switching can introduce power supply noise, leading to erratic behavior.

*Mitigation:* Place a 100 nF ceramic capacitor close to the VCC pin and ensure a low-impedance ground connection.

3. Floating Inputs

Unused control or data inputs left floating can cause excessive current draw or oscillation.

*Mitigation:* Tie unused inputs to VCC or GND via a resistor (1–10 kΩ).

4. Voltage Level Mismatch

The HC family operates at 2–6 V, but interfacing with 5 V TTL or 3.3 V CMOS devices requires attention to logic thresholds.

*Mitigation:* Verify VIH/VIL compatibility and use level shifters if necessary.

## Key Technical Considerations for Implementation

1. Timing Constraints

The MM74HC75N has a typical propagation delay of 15 ns (at 5 V). Ensure setup and hold times (tSU = 20 ns, tH = 5 ns) are met to avoid metastability.

2. Fan-Out Limitations

Each output can drive up to 10 LS-TTL loads. For higher loads, use a buffer to prevent signal degradation.

3. Thermal Management

While the device has low power dissipation, high-frequency operation in elevated ambient temperatures may require thermal analysis.

4. PCB Layout

Minimize trace lengths for data and enable signals to reduce parasitic inductance/capacitance, which can degrade signal integrity.

By addressing these factors

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