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MT41K128M16JT-125:K Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
MT41K128M16JT-125:KMicron20648Yes

MT41K128M16JT-125:K** is a DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) component manufactured by **Micron Technology**.

The MT41K128M16JT-125:K is a DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) component manufactured by Micron Technology. Below are its specifications, descriptions, and features:

Specifications:

  • Memory Type: DDR3 SDRAM
  • Density: 2Gb (128M x 16)
  • Organization: 128M words × 16 bits
  • Speed Grade: -125 (800 MHz, CL=11, tRCD=11, tRP=11)
  • Voltage: 1.5V ±0.075V
  • Package: 96-ball FBGA (Fine-Pitch Ball Grid Array)
  • Data Rate: 1600 Mbps (max)
  • Burst Length: 8 (sequential/interleave)
  • CAS Latency (CL): 11
  • Refresh Rate: 7.8µs (8192 cycles)
  • Operating Temperature: Commercial (0°C to +95°C) or Industrial (-40°C to +95°C) depending on variant

Descriptions:

  • The MT41K128M16JT-125:K is a high-performance DDR3 memory chip designed for computing, networking, and embedded applications.
  • It supports auto-precharge, on-die termination (ODT), and programmable burst lengths for efficient data handling.
  • The FBGA package ensures compact integration in space-constrained designs.

Features:

  • Low Power Consumption: 1.5V operation reduces power usage.
  • High-Speed Data Transfer: Up to 1600 Mbps data rate.
  • On-Die Termination (ODT): Improves signal integrity.
  • Programmable CAS Latency: Supports flexible timing configurations.
  • Auto-Refresh & Self-Refresh Modes: Enhances power efficiency.
  • Fly-by Topology Support: Optimized for high-speed signaling.
  • RoHS Compliant: Environmentally friendly manufacturing.

This memory chip is commonly used in servers, networking equipment, industrial systems, and high-performance computing applications.

*(Note: Always refer to Micron's official datasheet for detailed electrical characteristics and application guidelines.)*

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