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TAJC107K016RNJ Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
TAJC107K016RNJAVX100000Yes

TAJC107K016RNJ** is a surface-mount tantalum capacitor manufactured by **AVX**.

The TAJC107K016RNJ is a surface-mount tantalum capacitor manufactured by AVX. Below are its specifications, descriptions, and features:

Specifications:

  • Manufacturer: AVX
  • Capacitance: 100 µF (microfarads)
  • Voltage Rating: 16 V (volts)
  • Tolerance: ±10%
  • Case Size: J (EIA 3528-21, metric 7.3mm x 4.3mm)
  • ESR (Equivalent Series Resistance): Typically 1.5 Ω (ohms)
  • Operating Temperature Range: -55°C to +125°C
  • Termination: Standard RoHS-compliant solderable terminations
  • Polarity: Polarized (tantalum capacitors require correct polarity)

Descriptions:

  • Series: TAJ
  • Type: Solid Tantalum Chip Capacitor
  • Construction: Molded, surface-mount design
  • Dielectric Material: Tantalum pentoxide (Ta₂O₅)

Features:

  • High Reliability: Suitable for demanding applications
  • Low Leakage Current: Ensures stable performance
  • Stable Capacitance: Maintains value over a wide temperature range
  • RoHS Compliant: Meets environmental standards
  • Moisture Resistance: Suitable for various environmental conditions

This capacitor is commonly used in power supply filtering, decoupling, and signal conditioning in consumer electronics, telecommunications, and industrial applications.

(Note: Always verify datasheet details for exact performance characteristics.)

# TAJC107K016RNJ: Technical Analysis and Design Considerations

## Practical Application Scenarios

The TAJC107K016RNJ is a surface-mount, multilayer ceramic capacitor (MLCC) from AVX, designed for high-reliability applications. With a capacitance of 100µF (10V rating, ±10% tolerance) and X5R dielectric, it is well-suited for:

1. Power Supply Decoupling: The component’s low equivalent series resistance (ESR) and high capacitance make it ideal for smoothing voltage ripple in DC-DC converters and LDO regulators. It is commonly placed near IC power pins to mitigate high-frequency noise.

2. Energy Storage in Portable Electronics: Due to its compact size (case code 1210), the capacitor is used in smartphones, wearables, and IoT devices where board space is constrained but bulk capacitance is required for transient load support.

3. Automotive Electronics: The TAJC107K016RNJ meets AEC-Q200 qualifications, making it suitable for infotainment systems, ADAS modules, and engine control units (ECUs) where temperature stability (-55°C to +85°C) is critical.

4. Industrial Equipment: Its robustness against mechanical stress and thermal cycling ensures reliable performance in motor drives, PLCs, and power inverters.

## Common Design Pitfalls and Avoidance Strategies

1. Voltage Derating:

  • Pitfall: Operating the capacitor near its rated voltage (10V) can accelerate aging and reduce lifespan.
  • Solution: Derate to 50-70% of the rated voltage (e.g., 5–7V) to enhance longevity, especially in high-temperature environments.

2. Thermal Stress Cracking:

  • Pitfall: Mechanical stress from PCB flexure or reflow soldering can cause microcracks in the ceramic.
  • Solution: Follow AVX’s reflow profile recommendations and avoid placing the capacitor near board edges or flex points. Use soft-termination variants if mechanical stress is unavoidable.

3. Capacitance Loss Over Temperature:

  • Pitfall: X5R dielectrics exhibit significant capacitance variation (±15%) across the temperature range.
  • Solution: For precision applications, consider X7R or C0G dielectrics, or oversize capacitance by 20% to compensate for losses.

4. ESR and ESL Misestimation:

  • Pitfall: Ignoring frequency-dependent ESR/ESL can lead to ineffective decoupling at high frequencies.
  • Solution: Model the capacitor’s impedance curve (using manufacturer datasheets) and pair with smaller MLCCs (e.g., 0.1µF) for broadband noise suppression.

## Key Technical Considerations for Implementation

1. PCB Layout:

  • Place the capacitor as close as possible to the power pins of the target IC.
  • Use short, wide traces to minimize parasitic inductance.

2. Soldering:

  • Adhere to IPC-7351 land pattern guidelines to ensure proper solder fillet formation.
  • Avoid excessive reflow cycles to prevent terminal oxidation.

3. Aging and Lifetime:

  • Account for capacitance degradation over time (X5R

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