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RC0805FR-07511KL Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
RC0805FR-07511KLYAGEO10000Yes

RC0805FR-07511KL is a thick film chip resistor from YAGEO.

The RC0805FR-07511KL is a thick film chip resistor from YAGEO. Below are its specifications, descriptions, and features:

Specifications:

  • Manufacturer: YAGEO
  • Model Number: RC0805FR-07511KL
  • Resistance Value: 511 kΩ (511 kilohms)
  • Tolerance: ±1%
  • Power Rating: 1/8W (0.125W)
  • Operating Temperature Range: -55°C to +155°C
  • Voltage Rating: 150V
  • Temperature Coefficient (TCR): ±100 ppm/°C
  • Package/Case: 0805 (2012 Metric)
  • Termination: Standard SMD (Surface Mount Device)
  • Composition: Thick Film

Descriptions:

  • The RC0805FR-07511KL is a surface-mount resistor designed for general-purpose applications.
  • It is part of YAGEO's RC series, known for reliability and stability in electronic circuits.
  • Suitable for automated assembly processes due to its standard 0805 package size.

Features:

  • High Precision: ±1% tolerance ensures accurate resistance values.
  • Stable Performance: Thick film construction provides durability and consistent performance.
  • RoHS Compliant: Meets environmental standards for lead-free manufacturing.
  • Wide Application: Used in consumer electronics, industrial controls, automotive systems, and telecommunications.

This resistor is commonly used in PCBs where space efficiency and reliability are critical.

# RC0805FR-07511KL: Practical Applications, Design Pitfalls, and Implementation Considerations

## Practical Application Scenarios

The RC0805FR-07511KL is a surface-mount thick-film resistor from YAGEO’s RC series, featuring an 0805 package size, 511 kΩ resistance, and ±1% tolerance. Its compact form factor and stable performance make it suitable for a wide range of applications:

1. Signal Conditioning in Sensor Circuits

  • Used in voltage dividers for analog sensors (e.g., thermistors, pressure sensors) to scale output signals for ADC inputs.
  • Ensures minimal drift over temperature (TCR: ±100 ppm/°C), critical for precision measurements.

2. Pull-Up/Pull-Down Resistors in Digital Systems

  • Provides stable biasing for microcontroller I/O lines, ensuring reliable logic-level transitions.
  • Low parasitic inductance (<1 nH) minimizes signal integrity issues in high-speed digital circuits.

3. Feedback Networks in Power Supplies

  • Integrates into feedback loops of DC-DC converters or LDOs to set output voltages with high accuracy.
  • Handles moderate power dissipation (0.125 W at 70°C) without significant derating in typical conditions.

4. Filter and Timing Circuits

  • Paired with capacitors in RC filters (e.g., low-pass filters for EMI suppression) or oscillator timing networks.
  • Tight tolerance (±1%) ensures consistent cutoff frequencies or clock timing.

## Common Design Pitfalls and Avoidance Strategies

1. Power Dissipation Miscalculations

  • Pitfall: Overlooking derating at elevated temperatures or in high-density layouts.
  • Solution: Verify actual operating temperature and adhere to power derating curves (e.g., reduce to 50% of rated power at 125°C).

2. Voltage Coefficient Effects

  • Pitfall: Resistance drift under high voltage (>75% of rated voltage).
  • Solution: Operate below 75% of the maximum voltage rating (150 V) or select a higher-voltage-rated variant.

3. Mechanical Stress Failures

  • Pitfall: Cracking due to PCB flexure or improper reflow profiles.
  • Solution: Follow IPC-7351 land patterns and avoid placing near board edges or flex points.

4. Thermal Mismatch in Harsh Environments

  • Pitfall: CTE mismatch causing solder joint fatigue in thermal cycling.
  • Solution: Use SnPb or low-stress solder alloys in applications with extreme temperature swings.

## Key Technical Considerations for Implementation

1. Tolerance and TCR Selection

  • For precision applications, verify ±1% tolerance and ±100 ppm/°C TCR meet system error budgets.

2. Placement and Routing

  • Maintain adequate clearance from heat sources (e.g., power ICs) to avoid localized heating.
  • Use symmetric pad layouts to prevent tombstoning during reflow.

3. Alternative Components

  • For higher power needs, consider 1206 packages; for tighter TCR, opt for thin-film resistors.

By addressing these factors,

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