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MA3DF30 Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
MA3DF30PAN307Yes

MA3DF30** is a **3DFN (Dual Flat No-Lead) package** manufactured by **Panasonic**.

The MA3DF30 is a 3DFN (Dual Flat No-Lead) package manufactured by Panasonic.

Specifications:

  • Package Type: 3DFN (3.0mm x 3.0mm)
  • Lead Count: Typically 8 or more (varies by variant)
  • Pitch: 0.5mm (standard)
  • Height: ~0.8mm (ultra-thin profile)
  • Material: Lead-free (RoHS compliant)

Descriptions & Features:

  • Compact Design: Ideal for space-constrained PCB layouts.
  • High Thermal Performance: Efficient heat dissipation due to exposed thermal pad.
  • Surface-Mount Technology (SMT): Suitable for automated assembly.
  • Reliability: Meets industrial-grade standards for durability.
  • Applications: Commonly used in power management, RF modules, and portable electronics.

For exact electrical/mechanical specs, refer to Panasonic’s official datasheet for the specific MA3DF30 variant.

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