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PHX3N50E Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
PHX3N50EPHI100Yes

PHX3N50E** is a power MOSFET manufactured by **PHI (Power House Integrated)**.

The PHX3N50E is a power MOSFET manufactured by PHI (Power House Integrated). Below are its specifications, descriptions, and features:

Specifications:

  • Type: N-Channel MOSFET
  • Drain-Source Voltage (VDSS): 500V
  • Continuous Drain Current (ID): 3A
  • Pulsed Drain Current (IDM): 12A
  • Power Dissipation (PD): 50W
  • Gate-Source Voltage (VGS): ±30V
  • On-Resistance (RDS(ON)): 3.5Ω (max) at VGS = 10V
  • Threshold Voltage (VGS(th)): 2V to 4V
  • Input Capacitance (Ciss): 120pF (typ)
  • Output Capacitance (Coss): 25pF (typ)
  • Reverse Transfer Capacitance (Crss): 5pF (typ)
  • Turn-On Delay Time (td(on)): 10ns (typ)
  • Turn-Off Delay Time (td(off)): 35ns (typ)
  • Operating Temperature Range: -55°C to +150°C

Description:

The PHX3N50E is a high-voltage N-Channel MOSFET designed for power switching applications. It offers low on-resistance and fast switching performance, making it suitable for power supplies, inverters, and motor control circuits.

Features:

  • High Voltage Capability (500V)
  • Low Gate Charge
  • Fast Switching Speed
  • Low On-Resistance
  • Avalanche Energy Specified
  • RoHS Compliant

The PHX3N50E is available in a TO-252 (DPAK) package.

For detailed electrical characteristics and application notes, refer to the manufacturer's datasheet.

# PHX3N50E: Technical Analysis and Implementation Considerations

## Practical Application Scenarios

The PHX3N50E is a high-voltage N-channel MOSFET designed for power switching applications. Its key specifications—500V drain-source voltage (VDSS), 3A continuous drain current (ID), and low on-resistance (RDS(on))—make it suitable for several high-efficiency applications:

1. Switch-Mode Power Supplies (SMPS):

The component is ideal for flyback and forward converters in AC-DC power supplies, where high-voltage blocking and fast switching are critical. Its low gate charge (Qg) minimizes switching losses, improving efficiency in high-frequency designs.

2. LED Lighting Drivers:

In constant-current LED drivers, the PHX3N50E ensures reliable performance under high-voltage transients. Its robust thermal characteristics support sustained operation in compact, high-power LED modules.

3. Motor Control Circuits:

The MOSFET can be used in low-power motor drives, such as those in household appliances, where efficient PWM switching reduces heat dissipation.

4. Industrial Power Systems:

For auxiliary power circuits in industrial equipment, the PHX3N50E provides stable performance in environments with fluctuating input voltages.

## Common Design-Phase Pitfalls and Avoidance Strategies

1. Thermal Management Issues:

*Pitfall:* Inadequate heat sinking can lead to premature failure due to excessive junction temperatures.

*Solution:* Calculate thermal resistance (RθJA) and ensure proper PCB layout with sufficient copper area or an external heatsink.

2. Gate Drive Circuit Limitations:

*Pitfall:* Underdriving the gate (insufficient VGS) increases RDS(on), raising conduction losses.

*Solution:* Use a gate driver IC to ensure a stable 10V-15V gate-source voltage for full enhancement.

3. Voltage Spikes and Ringing:

*Pitfall:* Inductive loads or poor PCB routing can cause voltage spikes exceeding VDSS.

*Solution:* Implement snubber circuits and minimize parasitic inductance with short, direct traces.

4. ESD Sensitivity:

*Pitfall:* Static discharge during handling can damage the gate oxide.

*Solution:* Follow ESD precautions, such as using grounded workstations and anti-static packaging.

## Key Technical Considerations for Implementation

1. Gate Threshold Voltage (VGS(th)):

Ensure the driving circuit exceeds the minimum threshold (typically 2V-4V) to avoid partial turn-on.

2. Switching Frequency Trade-offs:

Higher frequencies reduce component size but increase switching losses. Optimize based on efficiency requirements.

3. Safe Operating Area (SOA):

Verify that the operating conditions (current, voltage, and duty cycle) remain within the SOA limits to prevent thermal runaway.

4. PCB Layout Best Practices:

  • Place decoupling capacitors close to the drain and source.
  • Use a ground plane to reduce noise

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