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UMH3N Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
UMH3NROHM2010Yes

UMH3N is a transistor manufactured by ROHM.

The UMH3N is a transistor manufactured by ROHM. Below are the factual specifications, descriptions, and features from the Manufactor Datasheet:

Specifications:

  • Type: NPN Transistor
  • Maximum Collector-Base Voltage (VCB): 50V
  • Maximum Collector-Emitter Voltage (VCE): 50V
  • Maximum Emitter-Base Voltage (VEB): 5V
  • Maximum Collector Current (IC): 500mA
  • Total Power Dissipation (Ptot): 400mW
  • DC Current Gain (hFE): 120 to 400 (at VCE = 6V, IC = 150mA)
  • Transition Frequency (fT): 200MHz (typical)
  • Operating Temperature Range: -55°C to +150°C
  • Package: SOT-323 (SC-70)

Descriptions & Features:

  • Low Saturation Voltage: Ensures efficient switching performance.
  • High Current Gain (hFE): Provides good amplification characteristics.
  • Compact SOT-323 Package: Suitable for space-constrained applications.
  • High-Speed Switching: Transition frequency (fT) of 200MHz makes it suitable for high-frequency applications.
  • Applications: Used in amplification, switching circuits, and high-frequency signal processing.

This information is based on ROHM's official datasheet for the UMH3N transistor.

# UMH3N MOSFET: Technical Analysis and Implementation Guidelines

## Practical Application Scenarios

The UMH3N, a N-channel MOSFET from ROHM, is designed for high-efficiency switching applications. Its key characteristics—low on-resistance (RDS(on)), fast switching speeds, and compact packaging—make it suitable for several critical applications:

1. Power Management in Portable Electronics

The UMH3N is widely used in DC-DC converters and load switches for smartphones, tablets, and wearables. Its low RDS(on) minimizes power loss, extending battery life. Designers often integrate it into buck/boost converters operating at frequencies up to 1 MHz.

2. Motor Drive Circuits

In small motor control systems (e.g., drones, robotics), the UMH3N’s fast switching reduces heat generation. Its ability to handle peak currents makes it ideal for PWM-driven H-bridge configurations.

3. LED Drivers

The MOSFET’s low gate charge (Qg) ensures efficient dimming control in high-brightness LED arrays. It is commonly deployed in constant-current drivers for automotive and industrial lighting.

4. Protection Circuits

The UMH3N serves as a reverse-polarity protection switch or load disconnect in power distribution systems, leveraging its low leakage current in off-state conditions.

## Common Design Pitfalls and Mitigation Strategies

1. Thermal Management Oversights

Despite its efficiency, improper PCB layout can lead to localized heating. Designers must:

  • Use adequate copper area for heat dissipation.
  • Avoid placing high-thermal-resistance components nearby.

2. Gate Drive Issues

Inadequate gate drive voltage or excessive trace inductance can degrade switching performance. Solutions include:

  • Ensuring VGS meets the datasheet threshold (typically 2.5–4.5V).
  • Placing gate resistors close to the MOSFET to minimize parasitic inductance.

3. Voltage Spikes and EMI

Fast switching induces voltage transients. Mitigation involves:

  • Adding snubber circuits across drain-source terminals.
  • Using low-ESR decoupling capacitors near the device.

4. Incorrect Current Ratings

Designers may overlook pulsed current limits, risking device failure. Always:

  • Derate continuous current specifications by 20–30% for margin.
  • Refer to SOA (Safe Operating Area) curves for transient conditions.

## Key Technical Considerations for Implementation

1. Gate-Source Voltage (VGS)

The UMH3N requires a VGS of 10V for full enhancement. Undervoltage increases RDS(on), while overvoltage (>±20V) risks gate oxide damage.

2. PCB Layout Optimization

  • Minimize loop area in high-current paths to reduce parasitic inductance.
  • Use separate ground planes for analog (gate drive) and power sections.

3. ESD Sensitivity

The MOSFET’s gate is ESD-sensitive. Implement:

  • TVS diodes for gate protection.
  • Proper handling protocols during assembly.

4. Dynamic Performance Trade-offs

Lowering RDS(on) often increases Qg. Balance these parameters based on switching frequency requirements.

By addressing these

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