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2SC2236-Y Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
2SC2236-YTOSHIBA200Yes

2SC2236-Y** is a high-frequency NPN silicon epitaxial planar transistor manufactured by **TOSHIBA**.

The 2SC2236-Y is a high-frequency NPN silicon epitaxial planar transistor manufactured by TOSHIBA. Below are its key specifications, descriptions, and features:

Specifications:

  • Transistor Type: NPN
  • Maximum Collector-Base Voltage (VCB): 160V
  • Maximum Collector-Emitter Voltage (VCE): 160V
  • Maximum Emitter-Base Voltage (VEB): 5V
  • Maximum Collector Current (IC): 1.5A
  • Maximum Power Dissipation (PC): 20W
  • Transition Frequency (fT): 50MHz
  • DC Current Gain (hFE): 60 to 320 (depending on operating conditions)
  • Operating Junction Temperature (Tj): -55°C to +150°C
  • Package Type: TO-220

Descriptions:

  • Designed for high-voltage, high-speed switching applications.
  • Suitable for amplification and general-purpose switching in electronic circuits.
  • Features low saturation voltage for improved efficiency.

Features:

  • High breakdown voltage (VCB = 160V, VCE = 160V).
  • High current capability (1.5A continuous collector current).
  • Fast switching speed with a transition frequency of 50MHz.
  • Robust thermal performance with a power dissipation of 20W.
  • TO-220 package for easy mounting and heat dissipation.

This transistor is commonly used in power amplifiers, switching regulators, and high-voltage circuits.

# Application Scenarios and Design Phase Pitfall Avoidance for the 2SC2236-Y Transistor

The 2SC2236-Y is a high-frequency, high-voltage NPN bipolar junction transistor (BJT) designed for applications requiring robust performance in demanding environments. Its key characteristics—including high current capability, fast switching speeds, and excellent thermal stability—make it a versatile component in various electronic circuits. However, improper design implementation can lead to performance degradation or premature failure. This article explores common application scenarios for the 2SC2236-Y and highlights critical pitfalls to avoid during the design phase.

## Key Application Scenarios

1. RF and High-Frequency Amplification

The 2SC2236-Y is well-suited for radio frequency (RF) amplification in communication systems, such as VHF/UHF transmitters and receivers. Its high transition frequency (fT) ensures minimal signal distortion, making it ideal for low-noise amplification stages. Engineers should ensure proper impedance matching and grounding to prevent parasitic oscillations that can degrade signal integrity.

2. Switching Power Supplies

In switch-mode power supplies (SMPS), the transistor’s fast switching capability and high breakdown voltage enable efficient power conversion. However, designers must account for inductive kickback by incorporating appropriate snubber circuits or freewheeling diodes to protect the transistor from voltage spikes.

3. Motor Drive Circuits

The 2SC2236-Y can be used in motor control applications, where it drives inductive loads such as solenoids or small DC motors. To prevent thermal runaway, adequate heat sinking and current-limiting resistors should be implemented, especially in high-duty-cycle operations.

4. Audio Amplification

While primarily an RF transistor, the 2SC2236-Y can also function in high-fidelity audio amplifiers due to its low distortion characteristics. Careful biasing and stability analysis are necessary to avoid crossover distortion and ensure linear amplification.

## Design Phase Pitfall Avoidance

1. Thermal Management

Excessive junction temperature is a leading cause of transistor failure. Designers must calculate power dissipation and select an appropriate heat sink, ensuring the device operates within its specified thermal limits. Thermal simulations or empirical testing can help validate cooling solutions.

2. Voltage and Current Ratings

Operating the 2SC2236-Y beyond its maximum collector-emitter voltage (VCEO) or collector current (IC) ratings can lead to catastrophic failure. Derating guidelines should be followed, particularly in high-temperature environments.

3. Stability in RF Circuits

Parasitic capacitance and inductance can cause unwanted oscillations in RF applications. Proper PCB layout techniques—such as minimizing trace lengths, using ground planes, and isolating high-frequency paths—are essential to maintain stability.

4. Proper Biasing

Incorrect biasing can result in poor linearity or excessive power dissipation. A well-designed bias network, possibly incorporating negative feedback, helps maintain optimal operating conditions across varying loads and temperatures.

5. Protection Against Transients

Inductive loads and fast switching can generate voltage spikes. Incorporating transient voltage suppressors (TVS diodes) or RC snubbers can mitigate these risks, extending the transistor’s lifespan.

## Conclusion

The 2SC2236-Y is a reliable choice for high-frequency, high-voltage applications when implemented correctly. By understanding its operational limits and addressing common design challenges—such as thermal management, stability, and transient protection—engineers can maximize performance while minimizing failure risks. Careful consideration during the design phase ensures robust and efficient circuit integration.

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