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1SS272(TE85L,F) Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
1SS272(TE85L,F)Toshiba42000Yes

SS272(TE85L,F)** is a Schottky barrier diode manufactured by Toshiba.

The SS272(TE85L,F) is a Schottky barrier diode manufactured by Toshiba. Below are its key specifications, descriptions, and features:

Specifications:

  • Type: Schottky Barrier Diode
  • Maximum Reverse Voltage (VRRM): 70V
  • Average Rectified Forward Current (IO): 2A
  • Peak Forward Surge Current (IFSM): 50A
  • Forward Voltage (VF): 0.55V (at 1A)
  • Reverse Current (IR): 0.5mA (at 70V)
  • Operating Temperature Range: -55°C to +125°C
  • Package: SOD-123FL

Descriptions:

  • Designed for high-speed switching applications.
  • Low forward voltage drop for improved efficiency.
  • Suitable for power supply circuits, DC-DC converters, and reverse polarity protection.

Features:

  • Fast Switching: Minimizes switching losses.
  • Low Power Loss: Due to low forward voltage.
  • High Reliability: Robust construction for stable performance.
  • Compact Package: SOD-123FL for space-saving PCB designs.

This diode is commonly used in power management, automotive electronics, and portable devices.

# 1SS272(TE85L,F) Diode: Practical Applications, Design Pitfalls, and Implementation Considerations

## Practical Application Scenarios

The 1SS272(TE85L,F) from Toshiba is a high-speed switching diode designed for applications requiring fast response times and low forward voltage. Its key characteristics—including a low reverse recovery time (trr) and minimal capacitance—make it suitable for the following scenarios:

1. High-Frequency Signal Demodulation

  • Used in RF and communication circuits for envelope detection and signal demodulation due to its fast switching speed.
  • Ideal for AM/FM receivers and mixer circuits where low distortion is critical.

2. Protection Circuits

  • Acts as a clamping diode in transient voltage suppression (TVS) applications, protecting sensitive ICs from voltage spikes.
  • Commonly deployed in I/O lines and power supply rails where ESD or inductive load switching may cause surges.

3. High-Speed Switching Circuits

  • Employed in digital logic circuits, pulse shaping, and signal conditioning where minimal propagation delay is required.
  • Suitable for high-frequency rectification in switch-mode power supplies (SMPS) and DC-DC converters.

4. Precision Instrumentation

  • Used in sampling circuits and analog multiplexers where low leakage current ensures signal integrity.

## Common Design Pitfalls and Avoidance Strategies

1. Thermal Management Oversights

  • Pitfall: Excessive forward current can lead to junction overheating, degrading performance.
  • Solution: Ensure proper heat dissipation by adhering to the rated IF(AV) (average forward current) and derating at elevated temperatures.

2. Incorrect Reverse Voltage Handling

  • Pitfall: Exceeding the VRRM (peak reverse voltage) may cause breakdown.
  • Solution: Select a diode with a VRRM at least 20% higher than the maximum expected reverse voltage.

3. Parasitic Capacitance Effects

  • Pitfall: High-frequency performance can be compromised by junction capacitance.
  • Solution: Use the 1SS272 in applications where its low Cj (junction capacitance) is optimal, avoiding high-capacitance alternatives.

4. Improper PCB Layout

  • Pitfall: Long trace lengths introduce inductance, affecting switching speed.
  • Solution: Minimize loop area and place the diode close to the load or switching element.

## Key Technical Considerations for Implementation

1. Forward Voltage (VF)

  • The 1SS272 exhibits a low VF (~0.5V at IF = 10mA), reducing power loss in low-voltage circuits.

2. Reverse Recovery Time (trr)

  • With a fast trr (~4ns), it minimizes switching losses in high-frequency applications.

3. Leakage Current (IR)

  • Ultra-low IR ensures minimal power loss in standby or precision circuits.

4. Packaging (SOD-323)

  • Compact footprint suits space-constrained designs but requires careful soldering to avoid thermal damage.

By addressing these factors, designers can maximize the performance of the

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