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W25Q64FVSSIGE Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
W25Q64FVSSIGEWINBOND36502Yes

W25Q64FVSSIGE is a serial flash memory device manufactured by Winbond.

The W25Q64FVSSIGE is a serial flash memory device manufactured by Winbond. Below are its factual specifications, descriptions, and features:

Specifications:

  • Manufacturer: Winbond
  • Part Number: W25Q64FVSSIGE
  • Memory Type: Serial NOR Flash
  • Density: 64Mb (8MB)
  • Interface: SPI (Serial Peripheral Interface)
  • Operating Voltage: 2.7V - 3.6V
  • Speed:
  • Standard SPI: Up to 104 MHz
  • Dual SPI: Up to 208 MHz (104 MHz x 2)
  • Quad SPI: Up to 416 MHz (104 MHz x 4)
  • Sector Size: 4KB (Uniform)
  • Block Size: 64KB (Uniform)
  • Page Size: 256 Bytes
  • Endurance: 100,000 Program/Erase Cycles per Sector
  • Data Retention: 20 Years
  • Operating Temperature Range: -40°C to +85°C
  • Package: SOIC-8 (208 mil)

Descriptions:

The W25Q64FVSSIGE is a high-performance SPI NOR Flash memory device designed for applications requiring fast read speeds, low power consumption, and high reliability. It supports standard, dual, and quad SPI modes for flexible data transfer. The memory is organized into uniform sectors and blocks, making it suitable for code execution (XIP) and data storage.

Features:

  • SPI Modes: Supports Standard, Dual, and Quad SPI for high-speed data transfer.
  • Advanced Security: Hardware and software write protection options.
  • Low Power Consumption: Deep power-down mode (1µA typical).
  • High Performance: Fast read and program/erase operations.
  • Uniform Sector Architecture: Simplifies firmware updates.
  • Reliable Data Retention: 20-year data retention.
  • Industrial-Grade: Wide operating temperature range (-40°C to +85°C).
  • Compatibility: Industry-standard pinout and command set.

This information is strictly based on the manufacturer's datasheet and product specifications.

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