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W25X10CLSNIG Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
W25X10CLSNIGWINBOND6729Yes

Manufacturer:** WINBOND **Part Number:** W25X10CLSNIG ### **Specifications:** - **Memory Type:** Serial NOR Flash - **Density:** 1Mbit (128KB) - **Interface:** SPI (Serial Peripheral Interface) - **Operating Voltage:** 2.

Manufacturer: WINBOND

Part Number: W25X10CLSNIG

Specifications:

  • Memory Type: Serial NOR Flash
  • Density: 1Mbit (128KB)
  • Interface: SPI (Serial Peripheral Interface)
  • Operating Voltage: 2.7V - 3.6V
  • Speed:
  • Clock Frequency: Up to 104MHz
  • Fast Read: 50MHz
  • Sector Size: 4KB
  • Page Size: 256 Bytes
  • Endurance: 100,000 Program/Erase Cycles (per sector)
  • Data Retention: 20 Years
  • Package: 8-pin SOIC (150mil)
  • Operating Temperature Range: -40°C to +85°C

Descriptions:

The W25X10CLSNIG is a 1Mbit serial NOR flash memory device from Winbond, designed for high-performance applications requiring reliable non-volatile storage. It supports standard SPI commands and features a flexible architecture with fast read, program, and erase operations.

Features:

  • SPI Modes: Supports Standard, Dual, and Quad SPI for enhanced performance.
  • Security: Hardware and software write protection.
  • Low Power Consumption: Deep power-down mode (1µA typical).
  • High Reliability: ECC (Error Correction Code) and wear-leveling support.
  • Compatibility: Industry-standard pinout and command set.

This device is commonly used in embedded systems, consumer electronics, and IoT applications.

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