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W971GG6KB-25 Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
W971GG6KB-25WINBOND3842Yes

W971GG6KB-25** is a memory chip manufactured by **Winbond**.

The W971GG6KB-25 is a memory chip manufactured by Winbond. Below are its key specifications, descriptions, and features:

Specifications:

  • Manufacturer: Winbond
  • Part Number: W971GG6KB-25
  • Memory Type: DDR2 SDRAM
  • Density: 1Gb (128MB)
  • Organization: 64M x 16
  • Speed Grade: -25 (400MHz @ CL=5)
  • Voltage: 1.8V ±0.1V
  • Interface: Parallel
  • Package: 84-ball FBGA (Fine-pitch Ball Grid Array)
  • Operating Temperature: Commercial (0°C to +70°C) or Industrial (-40°C to +85°C)

Descriptions:

  • The W971GG6KB-25 is a 1Gb DDR2 SDRAM chip designed for high-speed data transfer applications.
  • It operates at 400MHz (DDR2-800) with a CAS latency of 5 cycles.
  • The chip supports auto-refresh and self-refresh modes for power efficiency.
  • It is commonly used in embedded systems, networking devices, and consumer electronics.

Features:

  • DDR2-800 (PC2-6400) compliant
  • Burst Length: 4 or 8 (programmable)
  • Burst Type: Sequential or Interleaved
  • On-Die Termination (ODT) for signal integrity
  • 4 internal banks for concurrent operations
  • Low power consumption with active and standby modes
  • RoHS compliant

This chip is suitable for applications requiring high-speed, low-power memory solutions with reliable performance.

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