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LMBR1200FT1G Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
LMBR1200FT1GLRC6000Yes

LMBR1200FT1G** is a Schottky Barrier Rectifier manufactured by **LRC (Leshan Radio Company)**.

The LMBR1200FT1G is a Schottky Barrier Rectifier manufactured by LRC (Leshan Radio Company).

Key Specifications:

  • Type: Schottky Diode
  • Voltage Rating (VRRM): 200V
  • Average Forward Current (IO): 12A
  • Peak Forward Surge Current (IFSM): 150A
  • Forward Voltage Drop (VF): 0.85V (typical at 6A)
  • Reverse Leakage Current (IR): 500µA (max at rated voltage)
  • Operating Junction Temperature (TJ): -55°C to +150°C
  • Package: TO-220AB

Descriptions & Features:

  • High Efficiency: Low forward voltage drop reduces power loss.
  • Fast Switching: Suitable for high-frequency applications.
  • High Surge Current Capability: Robust performance under transient conditions.
  • Lead-Free & RoHS Compliant: Environmentally friendly.
  • Applications: Power supplies, inverters, DC-DC converters, and freewheeling diodes.

For detailed datasheet information, refer to the official LRC documentation.

# LMBR1200FT1G: Application Scenarios, Design Pitfalls, and Implementation Considerations

## 1. Practical Application Scenarios

The LMBR1200FT1G is a Schottky barrier diode designed for high-efficiency rectification in low-voltage, high-frequency applications. Its key characteristics—low forward voltage drop (VF) and fast switching—make it suitable for several critical use cases:

A. Power Supply Rectification

In switch-mode power supplies (SMPS) and DC-DC converters, the LMBR1200FT1G minimizes conduction losses due to its low VF (~0.45V at 1A). Its fast recovery time (<10ns) ensures efficient operation in high-frequency buck/boost topologies.

B. Reverse Polarity Protection

The diode’s low leakage current (<100µA) and high surge current tolerance (30A peak) make it ideal for protecting sensitive circuits from reverse voltage conditions in battery-powered devices, such as IoT sensors and portable electronics.

C. Freewheeling Diode in Inductive Loads

When used across relays, motors, or solenoids, the LMBR1200FT1G suppresses voltage spikes by providing a low-impedance path for inductive kickback, preventing damage to driving transistors.

D. RF and Signal Demodulation

Due to its low junction capacitance (~50pF), the diode is effective in high-frequency signal clamping and demodulation circuits, such as envelope detectors in communication systems.

## 2. Common Design Pitfalls and Avoidance Strategies

A. Thermal Management Oversights

Despite its low VF, the LMBR1200FT1G can experience significant power dissipation at high currents. Designers often underestimate thermal resistance (θJA ~ 50°C/W), leading to premature failure.

Mitigation:

  • Use adequate PCB copper area or heatsinks.
  • Derate current based on ambient temperature (refer to thermal derating curves).

B. Voltage Transient Susceptibility

The diode’s 40V reverse voltage rating may be insufficient for applications with high-voltage transients (e.g., automotive load dump).

Mitigation:

  • Implement TVS diodes or snubber circuits for additional protection.
  • Select a higher-voltage variant if transients exceed 80% of VRRM.

C. Incorrect Layout Practices

Poor PCB layout can introduce parasitic inductance, degrading switching performance and increasing EMI.

Mitigation:

  • Minimize loop area by placing the diode close to the switching node.
  • Use short, wide traces for anode/cathode connections.

## 3. Key Technical Considerations for Implementation

A. Forward Current vs. Temperature

The diode’s 1A continuous current rating drops with rising junction temperature. Ensure operation within safe limits by referencing the IF vs. TA derating graph.

B. Dynamic Characteristics

Switching losses become non-negligible above 500kHz. For ultra-high-frequency designs, verify reverse recovery charge (Qrr < 10nC) to avoid efficiency degradation.

C. Package Constraints

The SOD-123FL package offers compact footprint but limits thermal dissipation. For high-current applications

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