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HY62256ALLP-10 Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
HY62256ALLP-10HYUNDAI223Yes

HY62256ALLP-10** is a static random-access memory (SRAM) chip manufactured by **HYUNDAI**.

The HY62256ALLP-10 is a static random-access memory (SRAM) chip manufactured by HYUNDAI. Below are its specifications, descriptions, and features:

Specifications:

  • Type: Asynchronous SRAM
  • Density: 256Kb (32K x 8-bit)
  • Operating Voltage: 5V (±10%)
  • Access Time: 10ns (max)
  • Operating Temperature Range:
  • Commercial: 0°C to +70°C
  • Industrial: -40°C to +85°C
  • Package: 28-pin DIP (Dual In-line Package) or PLCC (Plastic Leaded Chip Carrier)
  • Standby Current (TTL): 10mA (max)
  • Standby Current (CMOS): 100μA (max)
  • Operating Current: 80mA (max)

Descriptions:

  • The HY62256ALLP-10 is a high-speed, low-power CMOS SRAM designed for applications requiring fast access times and low power consumption.
  • It features a non-volatile storage solution when paired with a backup battery.
  • The chip supports asynchronous operation, meaning it does not require a clock signal for read/write operations.
  • It is commonly used in embedded systems, industrial controls, networking devices, and legacy computing applications.

Features:

  • High-speed access time (10ns max)
  • Low power consumption in standby mode (CMOS level)
  • Fully static operation (no refresh required)
  • TTL-compatible inputs and outputs
  • Single 5V power supply
  • Three-state output for bus-oriented applications
  • Industrial-grade temperature range available

This SRAM chip is a reliable choice for systems requiring fast, low-power memory with a simple interface.

# HY62256ALLP-10: Technical Analysis and Implementation Considerations

## Practical Application Scenarios

The HY62256ALLP-10 is a 32K x 8-bit high-speed CMOS static RAM (SRAM) manufactured by Hyundai, designed for applications requiring fast, low-power memory access. Its key characteristics—10 ns access time, 5V operation, and low standby current—make it suitable for several critical use cases:

1. Embedded Systems and Microcontroller Expansion

  • The SRAM serves as external memory for microcontrollers (e.g., 8051, AVR, or ARM-based systems) where internal RAM is insufficient. Its fast access time ensures minimal latency in real-time control systems.

2. Industrial Automation and Data Logging

  • Used for temporary storage of sensor data or buffering high-speed communication (e.g., UART, SPI). The HY62256ALLP-10’s reliability in harsh environments (industrial temperature ranges with proper design) makes it ideal for PLCs and motor control systems.

3. Legacy System Upgrades and Repairs

  • Commonly found in retro computing and vintage electronics due to its pin compatibility with older SRAMs like the HM62256. Designers use it to replace obsolete components in arcade PCBs, early PCs, and test equipment.

4. Battery-Powered Devices

  • Low standby current (typically 10 µA) enables use in portable instrumentation or backup memory for RTC (Real-Time Clock) circuits, where power efficiency is critical.

## Common Design-Phase Pitfalls and Avoidance Strategies

1. Incorrect Voltage Supply and Decoupling

  • *Pitfall:* Marginal voltage (below 4.5V or above 5.5V) can cause data corruption or device failure.
  • *Solution:* Implement robust power regulation (LDOs) and place 100 nF decoupling capacitors near VCC and GND pins.

2. Improper Timing Constraints

  • *Pitfall:* Ignoring setup/hold times (e.g., tRC = 10 ns) leads to erratic read/write operations.
  • *Solution:* Verify timing margins in the target system using oscilloscope measurements or simulation tools.

3. Signal Integrity Issues

  • *Pitfall:* Long, un-terminated traces introduce noise, especially in high-speed designs.
  • *Solution:* Keep address/data lines short, use series termination resistors (22–33 Ω), and route ground planes to minimize crosstalk.

4. Inadequate Chip Select (CE) Management

  • *Pitfall:* Floating CE pins cause excessive power consumption or bus contention.
  • *Solution:* Tie unused chip select lines to VCC or GND as per datasheet recommendations and ensure proper logic-level control.

## Key Technical Considerations for Implementation

1. Interface Compatibility

  • Confirm voltage levels (TTL-compatible I/O) and bus loading, especially when interfacing with 3.3V microcontrollers (level-shifting may be required).

2. Temperature and Environmental Factors

  • The HY62256ALLP-10 operates at commercial (0°C to 70°C) or industrial (-40°C

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