Professional IC Distribution & Technical Solutions

Global leader in semiconductor components distribution and technical support services, empowering your product innovation and industry advancement

Product Catalog Contact Us
Home > WINBOND > W632GG6KB-15

W632GG6KB-15 Specifications

Detailed technical information and Application Scenarios

Product Details

PartNumberManufactorQuantityAvailability
W632GG6KB-15WINBOND1000Yes

Manufacturer:** WINBOND **Part Number:** W632GG6KB-15 ### **Specifications:** - **Type:** DDR3 SDRAM - **Density:** 2Gb (256M x 8) - **Organization:** 256M words × 8 bits - **Speed Grade:** -15 (DDR3-1600, 1.

Manufacturer: WINBOND

Part Number: W632GG6KB-15

Specifications:

  • Type: DDR3 SDRAM
  • Density: 2Gb (256M x 8)
  • Organization: 256M words × 8 bits
  • Speed Grade: -15 (DDR3-1600, 1.5V)
  • Data Rate: 1600 Mbps
  • Voltage: 1.5V ±0.075V
  • Interface: SSTL_15
  • Package: 78-ball FBGA (8mm x 10.5mm)
  • Operating Temperature: Commercial (0°C to +85°C) or Industrial (-40°C to +85°C)
  • Refresh Mode: Auto-refresh & Self-refresh
  • Burst Length: 8 (BL8) or On-the-fly (BC4/8)
  • CAS Latency (CL): 11, 10, 9, 8, 7, 6
  • Timings: tRCD=13.75ns, tRP=13.75ns, tRAS=35ns

Descriptions:

The W632GG6KB-15 is a high-speed 2Gb DDR3 SDRAM module from Winbond, designed for applications requiring high bandwidth and low power consumption. It supports JEDEC-standard DDR3 features, including programmable CAS latency and burst length.

Features:

  • JEDEC-Compliant: Fully compliant with DDR3 standards.
  • Low Power: 1.5V operation for reduced power consumption.
  • High Performance: Supports up to 1600Mbps data transfer rate.
  • On-Die Termination (ODT): Improves signal integrity.
  • Programmable Burst Length: Supports BL8 or BC4/8 modes.
  • Auto & Self-Refresh: Supports power-saving modes.
  • RoHS Compliant: Lead-free and halogen-free.

(Note: For detailed datasheets, refer to Winbond’s official documentation.)

Request Quotation

Part Number:
Quantity:
Target Price($USD):
Email:
Contact Person:
Additional Part Number
Quantity (Additional)
Special Requirements
Verification: =

Recommended Products

  • 25X10BVNIG ,1005,SOP8

    Manufacturer:** WINBOND **Part Number:** 25X10BVNIG ### **Specifications:** - **Memory Type:** Serial NOR Flash - **Density:** 1Mbit (128KB) - **Interface:** SPI (Serial Peripheral Interface) - **Voltage Range:** 2.

  • W25Q80DVSSIG ,41396,SOIC-8_208mil

    W25Q80DVSSIG** is a serial flash memory device manufactured by **Winbond**.

  • W25Q128JVFIQ ,7920,SOP-16年份：21+

    W25Q128JVFIQ is a serial flash memory device manufactured by Winbond.

  • SN74ABT245AN,TI,35,DIP20

    AT17F16-30CU,ATMEL,35,QFN

Sales Support

Our sales team is ready to assist with:

  • Fast quotation
  • Price Discount
  • Technical specifications
Contact sales